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Thermal Management in an IR Camera

by Ljunggren Hugo Falk

Institution: KTH Royal Institute of Technology
Year: 2016
Keywords: Engineering and Technology; Mechanical Engineering; Energy Engineering; Teknik och teknologier; Maskinteknik; Energiteknik
Posted: 02/05/2017
Record ID: 2114516
Full text PDF: http://urn.kb.se/resolve?urn=urn:nbn:se:kth:diva-192676


Abstract

Progress in the miniaturization and performance in the development of electronic components along withthe increased heat dissipation as a result of this, forces companies in the industry to streamline the productdevelopment and its thermal design procedures. The rapid development of electronical equipmentrequires the company to conduct detailed risk assessment and comprehensive design calculations to assurethat the product’s reliability and requirements are up to thermal standard. To be able to keep up with theever-changing technology with increased heat dissipation, companies need to incorporate an effectivethermal design in their product development cycle. In this report, an outline is proposed to what acompany with an already established product development cycle can do to include thermal thinking intheir design of products. The project is carried out in correspondence with FLIR Systems at whosefacilities the project was conducted. The project goals were to present a thermal design process that thecompany could use as a guideline and later test this methodology on a product with known thermalchallenges. In the background research, it was discovered that a few, yet simple, steps had to be taken tobe able to effectively incorporate thermal design. This also included a selection of simulation software tosimulate the product in different stages of the development cycle to assess the thermal situation. Severalsoftwares were analyzed and two were picked out for further analysis; FloTHERM XT and SolidWorksFlow Simulation. The results show that these software effectively could simulate a model with adequateaccuracy to be used in decision-making, but could increase in accuracy if proper steps are taken beforeactual application. ; Framsteg inom miniatyrisering och prestanda i elektroniska komponenter tillsammans med den ökadevärmegenereringen som en följd av detta tvingar företag i elektronikbranschen att effektiviseraproduktutvecklingen inom termisk design. Den snabba utvecklingen av elektronisk utrustning kräver attföretag genomför detaljerade riskbedömningar och omfattande konstruktionsberäkningar för attsäkerställa att produkterna upprätthåller tillförlitligheten och kraven som är satta. För att kunna hållajämna steg med den ständigt föränderliga tekniken behöver företagen införliva en effektiv termisk design isin produktutvecklingscykel. Denna rapport agerar som ett utkast till ett förslag på vad ett företag med enredan etablerad produktutvecklingscykel kan göra för att inkludera termisk tänkande i sin design avprodukter. Projektet är framtaget i överensstämmelse med FLIR Systems på vars anläggningar projektetgenomfördes. Målet med projektet var att presentera en termisk designprocess som företaget kan användasom en riktlinje och senare testa denna metod på en produkt med kända termiska utmaningar. I förstudienupptäcktes det att ett antal, men enkla, steg behövs vidtas för att effektivt kunna införliva termisk design iföretagets produktutveckling. Detta innefattade även att evaluera ett antal…

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